SLLS047M –FEBRUARY 1989–REVISED NOVEMBER 2014
(1) For more information about traditional and new thermal metrics see the IC Package Thermal Metrics application report (SPRA953). 7.4 Thermal Information THERMAL METRIC(1) MAX232xD MAX232xDW MAX232xN MAX232xNS SOIC SOIC wide PDIP SOP UNIT 16 PINS 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 73 57 67 64 °C/W
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MAX15027ATB T Maxim Integrated Products MAX15027ATB T
Request Maxim Integrated Products MAX15027ATB T IC LDO REG ADJ 1A 10-TDFN online from Elcodis view and download MAX15027ATB T pdf datasheet PMICVoltage RegulatorsLinear specifications. Page 2.
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Package Materials Maxim Integrated
Package Materials. IC package technical information is a crucial component of any circuit design impacting not only schematic details PCB size and layout but also environmental and reliability considerations. Our comprehensive portfolio of IC package technical data provides information on package types package outlines IC package land
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Package Thermal Resistance Values (Theta JA Theta JC) for
Package Thermal Resistance Values (Theta JA Theta JC) for Dallas Semiconductor Temperature Sensors Abstract Two common thermal-resistance values measured for IC packages are junction to ambient (Theta JA) and junction to case (Theta JC). These parameters are useful for calculating maximum power dissipation
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Maxim Integrated Products 3 MAX2090 50MHz to 1000MHz Analog VGA and Power Detector with Optional AGC Loop AC ELECTRICAL CHARACTERISTICS (Typical Application Circuit with analog attenuator set to minimum attenuation VCC = 4.75V to 5.8V fRF = 350MHz -40NC < TC < 95NC and RF ports are connected to 50I sources unless otherwise noted.
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LED Driver ICs for High Power LEDs ILD6150
60 V / 1.5 A High Efficiency Step-Down LED Driver IC Thermal Characteristics Data Sheet 11 Revision 3.2 4 Thermal Characteristics Figure 2 Total Power Dissipation The major part of the IC power dissipation is caused by the switch resistance in conductive state. Therefore
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Rev 0 12/10 MAX2982 Industrial Broadband Power
PACKAGE THERMAL CHARACTERISTICS (Note 1) ELECTRICAL CHARACTERISTICS (VDD33 = 3.3V VDD12 = VDVDD = VAVDD = 1.2V VAVSS = VDVSS = VDGND = 0V TA = -40 to 105NC unless otherwise noted. Typical values are at TA = 25NC.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER-SUPPLY CHARACTERISTICS Digital Supply Voltage Range VDD33 3.0
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_____ Maxim Integrated Products 1 For pricing delivery and ordering information please contact Maxim Direct at or visit Maxim s website at maxim-ic. MAX4936–MAX4939 Octal High-Voltage Transmit/Receive Switches Rev 1 3/11 Ordering Information/Selector Guide
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Package Thermal Resistance Values (Theta JA Theta JC) for
Package Thermal Resistance Values (Theta JA Theta JC) for Dallas Semiconductor Temperature Sensors Abstract Two common thermal-resistance values measured for IC packages are junction to ambient (Theta JA) and junction to case (Theta JC). These parameters are useful for calculating maximum power dissipation
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Thermal Resistance Analysis of Chip Packaging Develop Paper
ThetaJC the thermal resistance to the package shell = (Tj-Tc)/P is generally the thermal resistance to the top of the package so generally ThetaJC = ThetaJT ThetaJB thermal resistance to PCB = (Tj-Tb)/P
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THERMAL RESISTANCE TABLEAnalog Devices
thermal resistance table 1 type package code style lead count theta jc °c/w theta . ja °c/w pin common to substrate — board type metal can k to-3 2l to-3 4l 3 3 35 35 case case metal can h to-5 ms16(12) to -39 35 to-46 to-52 35 40 15 ufe 80 cu 4 n/a 150 150 440 mse12 360 — pin 3 pin 3 pin 3 mse16 cerdip j
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Package Thermal Resistance Values (Theta JA Theta JC) for
Package Thermal Resistance Values (Theta JA Theta JC) for Dallas Semiconductor Temperature Sensors Abstract Two common thermal-resistance values measured for IC packages are junction to ambient (Theta JA) and junction to case (Theta JC). These parameters are useful for calculating maximum power dissipation
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DS3231 datasheet(2/20 Pages) MAXIM Extremely Accurate
Exposure toabsolute maximum rating conditions for extended periods may affect device reliability. datasheet search datasheets Datasheet search site for Electronic Components and Semiconductors integrated circuits diodes and other semiconductors.
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High-Accuracy Temperature Measurements Maxim
Maxim > Design Support > Technical Documents > Application Notes > Sensors > APP 4875 Maxim > Design Support > Technical Documents > Application Notes > Temperature Sensors and Thermal Management > APP 4875 Keywords Platinum Resistance Temperature Detectors IEC 60751 Precision Delta Sigma ADCs PT100
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Package Thermal Resistance Values Maxim Integrated
Knowing these package thermal-resistance values can help the system designer evaluate the thermal performance of different package types. This application note lists Theta JA and Theta JC values for select Maxim temperature sensors and 1-Wire® devices organized by package and device type.
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High-Accuracy Temperature Measurements Maxim
Maxim > Design Support > Technical Documents > Application Notes > Sensors > APP 4875 Maxim > Design Support > Technical Documents > Application Notes > Temperature Sensors and Thermal Management > APP 4875 Keywords Platinum Resistance Temperature Detectors IEC 60751 Precision Delta Sigma ADCs PT100
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Thermal Derating Curves For Logic-Products Packages (Rev. B
Thermal metrics such as θJA and θJC are used to compare thermal performance of plastic integrated circuit (IC) packages. The thermal conductivity of all materials of the IC packaging and of the test board affect the thermal resistance values reported by semiconductor manufacturers.
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_____ Maxim Integrated Products 1 For pricing delivery and ordering information please contact Maxim Direct at or visit Maxim s website at maxim-ic. MAX5984 Single-Port 40W IEEE 802.3af/at PSE Controller with Integrated MOSFET Rev 0 12/11
Get PriceEVALUATION KIT AVAILABLE MAX14778 Dual ±25V Aboe-
PACKAGE THERMAL CHARACTERISTICS(Note 1) ELECTRICAL CHARACTERISTICS (VDD = 3.0V to 5.5V TA = -40NC to 85NC unless otherwise noted. Typical values are at VDD = 5V TA = 25NC.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS Supply Voltage Range VDD 3.0 5.5 V Supply Current IDD ENA = ENB = high VDD P VDDTH 4.27 10 mA
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Thermal Characterization of IC PackagesTutorialMaxim
ΘJA is the thermal resistance from junction to ambient measured as °C/W. Ambient is regarded as thermal "ground." ΘJA depends on the package board airflow radiation and system characteristics. Generally the effects of radiation are negligible. ΘJA values are listed for natural convention conditions (no forced air) only. ΘJC is the thermal resistance from junction to case.
Get PriceDS3231 datasheet(2/20 Pages) MAXIM Extremely Accurate
Exposure toabsolute maximum rating conditions for extended periods may affect device reliability. datasheet search datasheets Datasheet search site for Electronic Components and Semiconductors integrated circuits diodes and other semiconductors.
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MAX15053 datasheet(2/21 Pages) MAXIM High-Efficiency 2A
High-Efficiency 2A Current-ModeSynchronous Step-Down Switching Regulator2 _____ELECTRICAL CHARACTERISTICS(VIN = 5V TA = -40NC to 85NC unless otherwise noted typical values are at TA = 25NC.) (Note 4)ABSOLUTE MAXIMUM RATINGSNote 1
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Thermal Characteristics of Linear and Logic Packages
a package in a specific end-use environment. Thermal metrics such as θJA and θJC are used to compare thermal performance of plastic IC packages. The thermal conductivity of all materials of the IC package and the test-board influence the thermal-resistance values reported by
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MAX15053 datasheet(2/21 Pages) MAXIM High-Efficiency 2A
High-Efficiency 2A Current-ModeSynchronous Step-Down Switching Regulator2 _____ELECTRICAL CHARACTERISTICS(VIN = 5V TA = -40NC to 85NC unless otherwise noted typical values are at TA = 25NC.) (Note 4)ABSOLUTE MAXIMUM RATINGSNote 1
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High-Dynamic-Range Direct Up Maxim Integrated
For pricing delivery and ordering information please contact Maxim Direct 1 at or visit Maxim s website at maxim-ic. PART TEMP RANGE PIN-PACKAGE
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The MAX20340 is a universal bidirectional DC powerline communication (PLC) management IC with a 166.7kbps maximum bit rate. The device is capable of a maximum of 1.2A charge current.
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Monitoring Heat Dissipation In Electronic Systems Power
The primary goal in thermal design is to limit the junction temperature of integrated circuits. In their lists of absolute maximum ratings (Table 1) all IC manufacturers include the maximum operating junction temperature.Thus if a system is to maintain performance and reliability the board-level designer must ensure that no IC junction temperature exceeds its absolute-maximum rating.
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The IC s 2.0mA quiescent current with a 3.7V supply extends battery life in portable applications. The IC is available in a 14-pin TDFN (3mm x 3mm x 0.75mm) package specified over the extended -40NC to 85NC temperature range. Applications Features S Output Power 3.7W at 3I 10 THD 1.7W at 8I 10 THD with 5V Supply
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Thermal Characteristics of Linear and Logic Packages
a package in a specific end-use environment. Thermal metrics such as θJA and θJC are used to compare thermal performance of plastic IC packages. The thermal conductivity of all materials of the IC package and the test-board influence the thermal-resistance values reported by
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